International Journal of Science and Research (IJSR)

International Journal of Science and Research (IJSR)
Call for Papers | Fully Refereed | Open Access | Double Blind Peer Reviewed

ISSN: 2319-7064

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Research Paper | Material Science and Engineering | Algeria | Volume 5 Issue 5, May 2016

Effects of Copper Content and Ni Activator on the Densification of W-Cu Composite via Infiltration Process

Ali Grinou | Nabil Sadli | Mounder Romane | Aissa Toumi

Abstract: By using the infiltration method at a temperature of 1250C and a holding time of 2h in H2 atmosphere, W-Cu composites with different Cu content (5, 10, 15, 20, 25 and 30 Wt %) have been elaborated. In this study, a Tungsten porous substrate was prepared with cold uniaxial pressing. The results show that 25 Wt % Cu is the maximum cupper content that can be infiltrated. In order to enhance the composites properties, Ni has been added as activator of W matrix. In this case, it was found that (W-5Wt %Ni) 25Wt % Cu gives the most interesting result in terms of density, hardness and microstructure.

Keywords: Tungsten, compacts, W-Cu-Ni composite, activator, Infiltration

Edition: Volume 5 Issue 5, May 2016,

Pages: 1721 - 1725

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