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Research Paper | Material Science and Engineering | Volume 5 Issue 5, May 2016 | Pages: 1721 - 1725 | Algeria
Effects of Copper Content and Ni Activator on the Densification of W-Cu Composite via Infiltration Process
Abstract: By using the infiltration method at a temperature of 1250C and a holding time of 2h in H2 atmosphere, W-Cu composites with different Cu content (5, 10, 15, 20, 25 and 30 Wt %) have been elaborated. In this study, a Tungsten porous substrate was prepared with cold uniaxial pressing. The results show that 25 Wt % Cu is the maximum cupper content that can be infiltrated. In order to enhance the composites properties, Ni has been added as activator of W matrix. In this case, it was found that (W-5Wt %Ni) 25Wt % Cu gives the most interesting result in terms of density, hardness and microstructure.
Keywords: Tungsten, compacts, W-Cu-Ni composite, activator, Infiltration
How to Cite?: Ali Grinou, Nabil Sadli, Mounder Romane, Aissa Toumi, "Effects of Copper Content and Ni Activator on the Densification of W-Cu Composite via Infiltration Process", Volume 5 Issue 5, May 2016, International Journal of Science and Research (IJSR), Pages: 1721-1725, https://www.ijsr.net/getabstract.php?paperid=NOV163758, DOI: https://dx.doi.org/10.21275/NOV163758