Effects of Copper Content and Ni Activator on the Densification of W-Cu Composite via Infiltration Process

Ali Grinou, Nabil Sadli, Mounder Romane, Aissa Toumi

Abstract: By using the infiltration method at a temperature of 1250C and a holding time of 2h in H2 atmosphere, W-Cu composites with different Cu content (5, 10, 15, 20, 25 and 30 Wt %) have been elaborated. In this study, a Tungsten porous substrate was prepared with cold uniaxial pressing. The results show that 25 Wt % Cu is the maximum cupper content that can be infiltrated. In order to enhance the composites properties, Ni has been added as activator of W matrix. In this case, it was found that (W-5Wt %Ni) 25Wt % Cu gives the most interesting result in terms of density, hardness and microstructure.

Keywords: Tungsten, compacts, W-Cu-Ni composite, activator, Infiltration