Comparative Study of Radiated Emission in Various Microstripline Structures on Printed Circuit Boards
Abstract: The enormous advancement in science and technology has led to increase in the requirements for high speed data transmission. The increase in the speed of the digital circuits as well as the density of printed circuit board will often result in more challenging signal integrity issues. One of the most important signal integrity issues is radiated emission. We analyzed the radiation in different PCB structures like parallel microstripline, a 90° bend microstripline and serpentine microstripline. The radiation mechanism from various PCB structures is predicted and simulated by using Ansoft HFSS. Simulated results are compared with the existing structures.
Keywords: Signal Integrity, Radiated Emission, PCB, Microstriplines
How to Cite?: P.Rajeswari, Krithika Venkatesh, S.Shunmuga Lakshmi, "Comparative Study of Radiated Emission in Various Microstripline Structures on Printed Circuit Boards", Volume 2 Issue 4, April 2013, International Journal of Science and Research (IJSR), Pages: 188-192, https://www.ijsr.net/getabstract.php?paperid=IJSRON2013734, DOI: https://dx.doi.org/10.21275/IJSRON2013734