Design and Analysis of Temperature Sensor Array by Using Comsol Multiphysics 4.3
International Journal of Science and Research (IJSR)

International Journal of Science and Research (IJSR)
Call for Papers | Fully Refereed | Open Access | Double Blind Peer Reviewed

ISSN: 2319-7064


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M.Tech / M.E / PhD Thesis | Electrical Engineering | India | Volume 3 Issue 3, March 2014 | Popularity: 6.4 / 10


     

Design and Analysis of Temperature Sensor Array by Using Comsol Multiphysics 4.3

P. Mahalakshmi, S. Kalaiselvi


Abstract: This paper propose a new design and analysis of MEMS sensor array based on thermal stress and electric current properties. The COMSOL Multiphysics 4.3 software is used to design the sensor array of the sensing layer. The material selection is done based on the thermal analysis of the sensor array. The polysilicon yield a maximum displacement of 0.00143m and also it is suitable for human skin. So polysilicon can be proposed for sensor array and then analysis the performance of sensor array.


Keywords: Tactile sensor, sensor array, Comsol Multiphysics, Semiconductor material, Minimal access surgery


Edition: Volume 3 Issue 3, March 2014


Pages: 304 - 309



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P. Mahalakshmi, S. Kalaiselvi, "Design and Analysis of Temperature Sensor Array by Using Comsol Multiphysics 4.3", International Journal of Science and Research (IJSR), Volume 3 Issue 3, March 2014, pp. 304-309, https://www.ijsr.net/getabstract.php?paperid=20131115, DOI: https://www.doi.org/10.21275/20131115

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