Kareem A. Jasim, Rihab Nassr Fadhil
Abstract: A hand lay-up method was used to prepare Epoxy/ Copper composites. Epoxy was used as a matrix with Copper powder was fillers with average diameter (240.91 nm). The preparation method involves preparing carousel mold with different weight percentage of fillers (0, 5, 15, 25, 35, and 45 %). Standard specimens (in 30 mm diameter) for thermal conductivity assessments were prepared to test thermal conductivity. The result for thermal conductivity for Epoxy/Copper composites illustration that thermal conductivity increase with increasing weight percentage, For Epoxy/Copper composites, then it have maximum values of (1.502775 W/m.K), Which increased by 123.73 % compared with epoxy.
Keywords: Copper, thermal conductivity, Epoxy, Epoxy/ metal composites