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Research Paper | Manufacturing Engineering | China | Volume 5 Issue 3, March 2016

Springback Simulation of U-channel Forming Process based on Finite Element Analysis

Altaye Girum Temechache | Prof. Men Changfeng | Lie Duan | Han Chui Hong

Abstract: The phenomenon of springback is an inevitable common defect in sheet stamping process. In order to improve the forming quality of stamping parts and shorten the test time of the actual production of die, accurate prediction and effective control of the springback of stamping parts are necessary. U-shaped parts are one of the representative parts in sheet metal forming. This feature appears on many auto body cover panels such as side members and beams. The springback in the process of U-shape/channel stamping forming is difficult to resolve, especially the rebound of steel plate. How to accurately predict and control the springback effectively, there are many people in the study. This paper used a standard S-Rail as a benchmark [1] and finite element simulation analysis software DYNAFORM to simulate the forming and springback of parts. Finite element meshing and forming parameters settings are performed in the forming model of parts. Then the defect is analyzed in the forming process. To solve the fracture defect by optimizing the blank-holder force, it is used DYNAFORM software to do springback simulation of forming parts. Through the analysis of the springback of part, the springback compensation is made by offsetting the die surface. After compensation, the second drawing and springback simulation is also done. Compare and contrast the displacement value of before and after compensation. It is found that the simulation results of springback compensation and the springback of before compensation are minimized by fifty percent, thus it is validated that the method of offsetting die surface is effective in the compensation of springback.

Keywords: Finite Element Analysis, Numerical simulation, Sheet Metal Forming, springback compensation, DYNAFORM

Edition: Volume 5 Issue 3, March 2016,

Pages: 1487 - 1490

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